|
| MOQ: | 1 piece |
| Price: | /pieces >=2 pieces |
| Standard Packaging: | Original packaging box+Based on customer needs |
| Delivery Period: | 2-7 working days |
| In Stock | |
| Express, AIR | |
| ThinkSystem SR675 V3 Rack Server | |
| Payment Method: | L/C, D/A, D/P, T/T, Western Union |
| Supply Capacity: | /pieces >=2 pieces |
The SR675 V3 features a modular design for ultimate flexibility. With multiple different front compartment options, configurations include:
The ThinkSystem SR675 V3 is built on one or two 4th or 5th Generation AMD EPYC™ Processors and is designed to support the vast NVIDIA Hopper, Lovelace and Ampere datacenter portfolio and AMD Instinct™ MI Series Accelerators.
The ThinkSystem SR675 V3 delivers performance optimized for your workload, be it visualization, rendering or computationally intensive HPC and AI.
The NVIDIA H200 Tensor Core GPU delivers unprecedented acceleration—at every scale—to power the world’s highest performing elastic data centers for AI, data analytics, and HPC applications. The H200 can efficiently scale up or be partitioned into seven isolated GPU instances, with Second-Generation Multi-Instance GPU (MIG) providing a unified platform that enables elastic data centers to dynamically adjust to shifting workload demands.
Traditional air-cooling methods are reaching critical limits. Increases in component power especially on CPUs and GPUs have resulted in higher energy and infrastructure costs, extremely loud systems and heightened carbon footprints.
To combat these challenges and dissipate heat quickly, some models of the SR675 V3 employ Lenovo Neptune™ liquid-to-air hybrid cooling technology.
The heat of the NVIDIA HGX™ H200 GPUs is removed through a unique closed loop liquid-to-air heat exchanger that delivers the benefits of liquid cooling such as lower power consumption, quiet operation and higher performance without adding plumbing.
|
ThinkSystem SR675 V3 |
Technical Specification |
|
|
Form Factor |
3U rack |
|
|
Processor |
1x or 2x 4th or 5th Generation AMD EPYC™ Processors per node |
|
|
Memory |
Up to 3TB using 24x DDR5 DIMMs with max frequency 6000 MHz |
|
|
Base Module |
Up to 4x double-wide, full-height, full-length 600W GPUs; PCIe Gen5 x16
Or up to 4x single-wide, full-height, half-length PCIe Gen5 x16 Up to 8x 2.5” Hot Swap SAS/SATA/NVMe |
|
|
Dense Module |
Up to 8x double-wide, full-height, full-length 600W GPUs each PCIe Gen5 x16 on PCIe switch |
|
|
RAID Support |
Software RAID is not supported. Only RAID Controllers and HBA |
|
|
I/O Expansion |
Up to 6x PCIe Gen5 x16 adapters (2 front, 4 rear) and 1x OCP NIC 3.0 (x16/x8/x4) (rear) depending on the configuration |
|
|
Management |
Lenovo XClarity Controller 2 (XCC2), Confluent and Lenovo HPC & AI Software Stack |
|
| OS Support | Red Hat Enterprise Linux, SUSE Linux Enterprise Server, Microsoft Windows Server, VMware ESXi, Alma Linux, Rocky Linux Tested on Canonical Ubuntu |
|
Figure 1. Lenovo ThinkSystem SR675 V3 configured to support eight double-wide GPUs
There are three different base configurations of the SR675 V3 as shown in the following figure. The configurations determine the type and quantity of GPUs supported as well as the supported drive bays.
Figure 2. Three base configurations of the ThinkSystem SR675 V3
The following figure shows the main components on the front of the configuration with 4x SXM5 GPUs and 4x 2.5-inch hot-swap drives.
Figure 3. Front view of the SR675 V3 with 4x SXM5 GPUs and 4x 2.5-inch hot-swap drives
The following figure shows the main components on the front of the configuration with 4x double-wide PCIe GPUs and 8x 2.5-inch hot-swap drives.
Figure 4. Front view of the SR675 V3 with 4x double-wide PCIe GPUs and 8x 2.5-inch hot-swap drives
The following figure shows the main components on the front of the configuration with 8x double-wide PCIe GPUs and 6x E1.S EDSFF hot-swap drives. In this configuration, there are two front I/O PCIe slots.
Figure 5. Front view of the SR675 V3 with 8x double-wide PCIe GPUs, 6x E1.S EDSFF hot-swap drives, and front I/O
The following figure shows the components visible from the rear of the server. Note that not all configurations support PCIe slots at the rear of the server
Figure 6. Rear view of the ThinkSystem SR675 V3
The following figure shows the internals of the server with four double-wide GPUs installed.
Figure 7. Internal view of the SR675 V3 with 4x double-wide PCIe GPUs and 8x 2.5-inch drives
The following figure shows the internals of the server with eight double-wide GPUs installed (four removed to show the PCIe switch board underneath).
Figure 8. Internal view of the SR675 V3 with 8x double-wide PCIe GPUs and 6x EDSFF hot-swap drives
Figure 9. SR675 V3 system architectural block diagram
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|
| MOQ: | 1 piece |
| Price: | /pieces >=2 pieces |
| Standard Packaging: | Original packaging box+Based on customer needs |
| Delivery Period: | 2-7 working days |
| In Stock | |
| Express, AIR | |
| ThinkSystem SR675 V3 Rack Server | |
| Payment Method: | L/C, D/A, D/P, T/T, Western Union |
| Supply Capacity: | /pieces >=2 pieces |
The SR675 V3 features a modular design for ultimate flexibility. With multiple different front compartment options, configurations include:
The ThinkSystem SR675 V3 is built on one or two 4th or 5th Generation AMD EPYC™ Processors and is designed to support the vast NVIDIA Hopper, Lovelace and Ampere datacenter portfolio and AMD Instinct™ MI Series Accelerators.
The ThinkSystem SR675 V3 delivers performance optimized for your workload, be it visualization, rendering or computationally intensive HPC and AI.
The NVIDIA H200 Tensor Core GPU delivers unprecedented acceleration—at every scale—to power the world’s highest performing elastic data centers for AI, data analytics, and HPC applications. The H200 can efficiently scale up or be partitioned into seven isolated GPU instances, with Second-Generation Multi-Instance GPU (MIG) providing a unified platform that enables elastic data centers to dynamically adjust to shifting workload demands.
Traditional air-cooling methods are reaching critical limits. Increases in component power especially on CPUs and GPUs have resulted in higher energy and infrastructure costs, extremely loud systems and heightened carbon footprints.
To combat these challenges and dissipate heat quickly, some models of the SR675 V3 employ Lenovo Neptune™ liquid-to-air hybrid cooling technology.
The heat of the NVIDIA HGX™ H200 GPUs is removed through a unique closed loop liquid-to-air heat exchanger that delivers the benefits of liquid cooling such as lower power consumption, quiet operation and higher performance without adding plumbing.
|
ThinkSystem SR675 V3 |
Technical Specification |
|
|
Form Factor |
3U rack |
|
|
Processor |
1x or 2x 4th or 5th Generation AMD EPYC™ Processors per node |
|
|
Memory |
Up to 3TB using 24x DDR5 DIMMs with max frequency 6000 MHz |
|
|
Base Module |
Up to 4x double-wide, full-height, full-length 600W GPUs; PCIe Gen5 x16
Or up to 4x single-wide, full-height, half-length PCIe Gen5 x16 Up to 8x 2.5” Hot Swap SAS/SATA/NVMe |
|
|
Dense Module |
Up to 8x double-wide, full-height, full-length 600W GPUs each PCIe Gen5 x16 on PCIe switch |
|
|
RAID Support |
Software RAID is not supported. Only RAID Controllers and HBA |
|
|
I/O Expansion |
Up to 6x PCIe Gen5 x16 adapters (2 front, 4 rear) and 1x OCP NIC 3.0 (x16/x8/x4) (rear) depending on the configuration |
|
|
Management |
Lenovo XClarity Controller 2 (XCC2), Confluent and Lenovo HPC & AI Software Stack |
|
| OS Support | Red Hat Enterprise Linux, SUSE Linux Enterprise Server, Microsoft Windows Server, VMware ESXi, Alma Linux, Rocky Linux Tested on Canonical Ubuntu |
|
Figure 1. Lenovo ThinkSystem SR675 V3 configured to support eight double-wide GPUs
There are three different base configurations of the SR675 V3 as shown in the following figure. The configurations determine the type and quantity of GPUs supported as well as the supported drive bays.
Figure 2. Three base configurations of the ThinkSystem SR675 V3
The following figure shows the main components on the front of the configuration with 4x SXM5 GPUs and 4x 2.5-inch hot-swap drives.
Figure 3. Front view of the SR675 V3 with 4x SXM5 GPUs and 4x 2.5-inch hot-swap drives
The following figure shows the main components on the front of the configuration with 4x double-wide PCIe GPUs and 8x 2.5-inch hot-swap drives.
Figure 4. Front view of the SR675 V3 with 4x double-wide PCIe GPUs and 8x 2.5-inch hot-swap drives
The following figure shows the main components on the front of the configuration with 8x double-wide PCIe GPUs and 6x E1.S EDSFF hot-swap drives. In this configuration, there are two front I/O PCIe slots.
Figure 5. Front view of the SR675 V3 with 8x double-wide PCIe GPUs, 6x E1.S EDSFF hot-swap drives, and front I/O
The following figure shows the components visible from the rear of the server. Note that not all configurations support PCIe slots at the rear of the server
Figure 6. Rear view of the ThinkSystem SR675 V3
The following figure shows the internals of the server with four double-wide GPUs installed.
Figure 7. Internal view of the SR675 V3 with 4x double-wide PCIe GPUs and 8x 2.5-inch drives
The following figure shows the internals of the server with eight double-wide GPUs installed (four removed to show the PCIe switch board underneath).
Figure 8. Internal view of the SR675 V3 with 8x double-wide PCIe GPUs and 6x EDSFF hot-swap drives
Figure 9. SR675 V3 system architectural block diagram
