![]() |
MOQ: | 1 pieces |
Price: | Determine based on market prices |
Standard Packaging: | Original packaging box+Based on customer needs |
Delivery Period: | 2-7 working days |
In Stock | |
LCL, AIR, FCL, Express | |
1288H V7 | |
Payment Method: | L/C, D/A, D/P, T/T, Western Union |
Supply Capacity: | /pieces >=2 pieces |
Main application scenarios:
HPC
High-density virtualization
OA
Specifications | |
Form Factor | 1U rack server |
Processor | 1 or 2 x 4th or 5th Gen Intel® Xeon® Scalable processors with TDP up to 385 W per processor |
Chipset | Emmitsburg PCH |
Memory | 32 x DDR5 DIMMs, with up to 5600 MT/s speed |
Local Storage |
Supports hot-swappable drives in the following configurations: • 4 x 3.5ʺ SAS/SATA drives/SSDs • 8-12 x 2.5ʺ SAS/SATA drives/SSDs • 2 x M.2 SSDs |
RAID | RAID 0, 1, 10, 1E, 5, 50, 6, or 60; optional supercapacitor for cache data power failure protection, RAID level migration, drive roaming, self-diagnosis, and remote web-based configuration |
Network |
Provides expansion capability of multiple types of networks Supports OCP 3.0 NICs. The two FlexIO card slots support two OCP 3.0 NICs, which can be configured as required. Hot swap and PCIe 5.0 are supported |
PCIe Expansion | Provides 5 x PCIe slots, including 2 x FlexIO slots dedicated for OCP 3.0 NICs and 3 x PCIe slots, and 1 slots support PCIe 5.0 |
Operating Temperature | 5ºC to 45ºC (41ºF to 113ºF), compliant with ASHRAE Classes A1, A2, A3, and A4 |
50% Better Heat Dissipation Capability Than a Single Heat Sink
Heat pipe remote heat dissipation technology ensures reliable heat dissipation and stronger temperature adaptation
66% Less System Downtime
Unique AI memory fault self-healing ensures stable system running
![]() |
MOQ: | 1 pieces |
Price: | Determine based on market prices |
Standard Packaging: | Original packaging box+Based on customer needs |
Delivery Period: | 2-7 working days |
In Stock | |
LCL, AIR, FCL, Express | |
1288H V7 | |
Payment Method: | L/C, D/A, D/P, T/T, Western Union |
Supply Capacity: | /pieces >=2 pieces |
Main application scenarios:
HPC
High-density virtualization
OA
Specifications | |
Form Factor | 1U rack server |
Processor | 1 or 2 x 4th or 5th Gen Intel® Xeon® Scalable processors with TDP up to 385 W per processor |
Chipset | Emmitsburg PCH |
Memory | 32 x DDR5 DIMMs, with up to 5600 MT/s speed |
Local Storage |
Supports hot-swappable drives in the following configurations: • 4 x 3.5ʺ SAS/SATA drives/SSDs • 8-12 x 2.5ʺ SAS/SATA drives/SSDs • 2 x M.2 SSDs |
RAID | RAID 0, 1, 10, 1E, 5, 50, 6, or 60; optional supercapacitor for cache data power failure protection, RAID level migration, drive roaming, self-diagnosis, and remote web-based configuration |
Network |
Provides expansion capability of multiple types of networks Supports OCP 3.0 NICs. The two FlexIO card slots support two OCP 3.0 NICs, which can be configured as required. Hot swap and PCIe 5.0 are supported |
PCIe Expansion | Provides 5 x PCIe slots, including 2 x FlexIO slots dedicated for OCP 3.0 NICs and 3 x PCIe slots, and 1 slots support PCIe 5.0 |
Operating Temperature | 5ºC to 45ºC (41ºF to 113ºF), compliant with ASHRAE Classes A1, A2, A3, and A4 |
50% Better Heat Dissipation Capability Than a Single Heat Sink
Heat pipe remote heat dissipation technology ensures reliable heat dissipation and stronger temperature adaptation
66% Less System Downtime
Unique AI memory fault self-healing ensures stable system running